- reactive sputter deposition
- = reactive sputtering deposition осаждение методом реактивного распыления
The New English-Russian Dictionary of Radio-electronics. F.V Lisovsky . 2005.
reactive sputter deposition
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Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… … Wikipedia
Pulsed laser deposition — (PLD) is a thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the… … Wikipedia
Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… … Wikipedia
Sputtern — Das Sputtern (aus dem Englischen to sputter = zerstäuben) – oder auf deutsch, die Kathodenzerstäubung – ist ein physikalischer Vorgang, bei dem Atome aus einem Festkörper (Target) durch Beschuss mit energiereichen Ionen (vorwiegend… … Deutsch Wikipedia
Ohmic contact — An ohmic contact is a region on a semiconductor device that has been prepared so that the current voltage (I V) curve of the device is linear and symmetric. If the I V characteristic is non linear and asymmetric, the contact is not ohmic, but is… … Wikipedia
Thin film — A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Electronic semiconductor devices and optical coatings are the main applications benefiting from thin film construction. A… … Wikipedia
Titanium nitride — (titaniumnitrogen) (sometimes known as Tinite or TiNite) is an extremely hard ceramic material, often used as a coating on titanium alloy, steel, carbide, and aluminium components to improve the substrate s surface properties. Applied as a thin… … Wikipedia
Plasma processing — is a plasma based material processing technology that aims at modifying the chemical and physical properties of a surface.Plasma processing techniques include: *Plasma activation *Plasma modification *Plasma functionalization *Plasma… … Wikipedia
Cavity magnetron — Magnetron with section removed (magnet is not shown) … Wikipedia
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
